Where co-packaged optics (CPO) technology stands in
Find out CPO''s 2025 scorecard and what lies ahead for this optical interconnect technology in 2026 and beyond.
Home / Latest Developments in CPO Optical Modules
From Jensen Huang showcasing CPO switches at GTC 2025 to a wide range of vendors demonstrating optical engines integrated inside ASIC packages at OFC 2025, CPOs are everywhere. Even as SerDes speeds increase, copper-based links struggle to deliver the required bandwidth per watt, once equalization and retiming overheads are factored in. Third, distance itself has become a problem: latency, energy per bit, and signal integrity degrade sharply with electrical reach. Silicon photonics (SiPh) offers a high degree of integration and cost-effectiveness, helping to enhance optical module performance while driving down costs. Coherent technology facilitates long-distance, high-speed transmission with exceptional signal quality. Co-packaged optics (CPO) technology, a key enabler for next-generation data center architectures, promises unprecedented bandwidth density and power efficiency by tightly integrating optical engines with switch silicon.
Find out CPO''s 2025 scorecard and what lies ahead for this optical interconnect technology in 2026 and beyond.
Traditional pluggable optical modules are increasingly constrained by signal loss, power consumption, and latency because they require long electrical traces
As data centers continue to evolve, Co-Packaged Optics (CPO) technology is gradually replacing traditional pluggable optical modules, emerging
Rising demand for CPO in AI data centers is expected to drive development across the semiconductor supply chain. TrendForce forecasts that CPOs will steadily increase their share of
While linear-drive pluggable modules remain competitive, CPO is expected to offer unmatched customization and scalability, with large-scale
From Jensen Huang showcasing CPO switches at GTC 2025 to a wide range of vendors demonstrating optical engines integrated inside ASIC
CPO switches shorten the electrical signal path, reduce power consumption, and decrease the number of pluggable modules by co-packaging optical modules with
Optical Networking Several papers from major optics vendors tackled optical interconnects that will carry data between next-generation AI accelerators both within and between
The testing process for SiPh chips reportedly spans four main phases from wafer level to module packaging: photonic integrated circuit (PIC) testing, wafer-level optoelectronic integration
As a result, optical transmission technologies are becoming increasingly important. TrendForce forecasts that co-packaged optics (CPO) will steadily increase their share of optical
The global Optical Transceiver market size was estimated at USD 13.08 Billion in 2024 and is estimated to grow at a CAGR of 15.41% from 2025 to 2032.
Check the latest developments in optical module technology, focusing on key advancements such as SiPh, Coherent Technology, LPO, LRO, and CPO.
A CPO optical module integrates optical and electronic components to boost data center speed, efficiency, and bandwidth while reducing power use.
On January 21, JCET announced a major breakthrough in its co-packaged optics (Co-Packaged Optics, CPO) technology development. Silicon
Explore AI data center interconnect trends in 2026, including CPO, optical interconnect, OCS, and the real challenges slowing large-scale deployment.
In the 5G era, the demand for high-bandwidth computing, transmission, and storage has led to the development of optoelectronic
SCALE CPO solution is the industry''s first OCI MSA capable platform and built with GF''s proven silicon photonics technology MALTA, N.Y., May 4, 2026 – GlobalFoundries (Nasdaq: GFS)
A surge in AI development created a new wave in demand for optical connectivity in 2023-2025 and it will sustain the market''s growth through 2030. The Figure below
The SCALE CPO solution uses both coarse and dense wavelength-division multiplexing (CWDM and DWDM) for bi-directional data transmission over each optical fiber, delivering significant
This article provides a comprehensive overview of CPO optical modules, exploring their technology, benefits, challenges, and the pivotal role
Coherent announced it will demonstrate multiple co-packaged optics (CPO) technologies at OFC 2026 in Los Angeles.
Nvidia''s $4 billion investment in optical component suppliers Lumentum and Coherent marks the AI hardware linchpin''s commitment to optical
Unlike pluggable optics, CPO does not yet benefit from a fully established, interoperable ecosystem; mechanical interfaces, thermal
Meeting market expectations and building confidence in co-packaged optics will require more than performance demonstrations. CPO adoption
In switch network scenarios, the focus of chip-to-chip optical interconnects is on Co-Packaged Optics (CPO) technology, aiming to replace pluggable optical modules.
This report examines the latest developments in connectivity, lasers, and cooling systems for CPO as well as showing how CPO modules will be used in four kinds of data center.
Though CPO development is still in its infancy and industry standards are yet to be fully established, its mature application could bring significant
Co-packaged optics (CPO) is gaining significant attention as the next architecture for next-generation switching. The shift toward co-packaged optics is also reshaping competitive
These demonstrations highlight Coherent''s ability to support multiple optical architectures for co-packaged optics, leveraging its expertise across key
Co-packaged optics (CPO) technology, a key enabler for next-generation data center architectures, promises unprecedented bandwidth density
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