GlobalFoundries accelerates adoption of co-packaged optics for
Built with GF''s advanced silicon photonics technology, the SCALE CPO solution utilizes both coarse and dense wavelength-division multiplexing (CWDM, DWDM) for bi-directional data
Optical module CPO and silicon photonics
Home / Optical module CPO and silicon photonics
Co-packaged optics (CPO) technology, a key enabler for next-generation data center architectures, promises unprecedented bandwidth density and power efficiency by tightly integrating optical engines with switch silicon. GF's SCALE solution, or Silicon photonics Co-packaged Advanced Light Engine solution, is the industry's first Optical Compute Interconnect Multi-Source Agreement (OCI MSA) capable platform, exceeding the requirements for the OCI MSA's optical interconnect specification for modern AI scale-up. , May 5, 2026 — GlobalFoundries (GF) has introduced an optical module solution for co-packaged optics (CPO). As AI clusters push beyond 100 Tb/s per node, the gap between what silicon can generate and what traditional copper interconnects can deliver is widening fast. Three hurdles are now colliding: First, power delivery is nearing practical limits.
