NVIDIA Corporation

1.6 Terabits Per Second Per Port Switches to Deliver 3.5x Energy Savings and 10x Resilience in AI Factories Joint Inventions and Collaborations

PIC, Wafer, & Co-Packaged Optics

Our aim is to help customers unlock scalable and cost-effective high-volume manufacturing of photonic integrated circuits (PICs), co-packaged optics and

Optical packages

The Boschman group focuses on optical devices with exposed windows or over-mold devices in transparent encapsulation (epoxy or silicone), without fibers.

Optoplex Corporation

Optoplex Corporation is a leading supplier of cutting-edge photonic components, modules and subsystems for dynamic wavelength management and signal conditioning.

Designing Co-Packaged Optics (CPO) with Ansys

Why Co-Packaged Optics? Co-packaged optics (CPO) considered as a promising solution for data center interconnects ‐ Increasing traffic at data center ‐ Conventional pluggable optics facing

Our offering

We support all major material platforms, such as SiN, InP, LiNbO3 and GaAs, and can even co-package multiple PIC technologies into one product. By

Photonics Foundry

We can help you design and assemble prototypes, refine the assembly and packaging processes required for your manufacturing, and

High Quality Optical Module Wholesaler

Hyper Photonix is a leading optical transceiver supplier for high-speed networking applications in data center, enterprise, and optical transmission networks. The

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South Africa (Sales)

+27 21 850 1234

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EU Manufacturing Center

+34 936 214 587

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Headquarters (Spain)

Avinguda de la Garriga 23, 08830 Sant Boi de Llobregat, Barcelona, Spain