PCB used in 1 6T optical modules

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While the OSFP1600 supports future switch silicon with 200 Gb/s electrical lanes, there is broad interest in 1. The OSFP-XD ("eXtra Dense") form factor was developed to meet this requirement. Optical modules are critical components in modern communication systems, acting as the bridge between electrical and optical signals. The Printed Circuit Board (PCB) at the heart of these modules is no longer a simple substrate but a highly engineered system. Switches and optical PHYs operating at these data rates will extend to 224G data rates with PAM-4 signaling format, bringing the required channel bandwidth to 56 GHz per lane.

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